At Huawei Connect 2025 in Shanghai, Huawei detailed its roadmap for future Ascend chips, including the Ascend 950, 960, and 970 series. The company is focused on delivering high-performance AI clusters to hyperscalers via ‘SuperPoDs’. The Atlas 950 SuperPoD, powered by the Ascend 950DT chips, is slated for Q4 2026 release.
Beyond AI, Huawei is also developing general-purpose computing capabilities. Two Kunpeng 950 processor models are expected to launch in Q1 2026. Both the NPU and general computing SuperPoDs will leverage UnifiedBus 2.0, an open interconnection protocol, for efficient data transfer.